Package Product Development Engineer

1.负责半导体Memory/ASIC封装新产品开发验证和量产导入；  

2.新产品封装构造/BOM确认和检验，封装工程技术原理分析和研究；  

3.根据客户需求制定项目开发计划，并协调内外部资源对计划目标进行有效管理；  

4.新产品技术风险分析和管理，树立DOE和验证方案，问题改善，确保开发任务高质量完成；  

5.熟悉新产品关联品质Spec和可靠性条件，为新产品品质提升，提供技术解决方案；  

6.问题改善报告/开发各个阶段报告书撰写和汇报。

Responsibility:   

1. Package Product Development and NPI for Memory/ASIC Package.  

2. Check and confirm PKG architecture/BOM, and principle analyze of assembly process technologies.  

3. Make development planning according to customer’s requirement; and coordinate with internal and external resources to manage it efficiently.  

4. Analyze and manage technical risk of new products, and set up DOE to solve related issues to ensure development be completed with high quality.  

5. Familiar with package related Spec and reliability knowledge, and propose technical solutions to improve product’s quality.  

6. Complete reports of each development phases.  

任职要求：  

1. 微电子/材料/物理/化学等专业本科及以上学历；  

2. 具有NPI/工程/材料等半导体封装相关工作经验者优先；  

3. 责任心强，善于团队合作，具备良好沟通能力和逻辑能力，能够适应较强工作压力；  

4. 具有良好的风险管理意识和日程管理能力；  

5. 具有良好的英语(或 韩语) 听说读写能力。

Requirements:   

1. BS degree or above, major in Microelectronics/Materials/Physics/Chemistry and related.  

2. Experience performing Package Assembly related (NPI/Process/Material) is preferred .  

3. Strong responsibility and good team work/communication/logic skills, Adapted to work under pressure.  

4. Good risk management and schedule management skills .  

5. Good verbal and written English (or Korean).